Fine Pitch Through Hole (TGV) Formation and Metal Filling Technology on Quartz Glass Substrate (Developed Product)
Configuration of Substrate
（Cross Section-１）
・Synthetic Quartz：φ4 inch×0.22mmt
・Open Mouth Diameter of TGV：φ40μm
・TGV Pitch：150μm
・Metal is filled up voidlessly in TGV.
Benefits:
・Glass Via without Microcrack
・Glass Via Metal Filled without Void
・High Flatness of Glass and Metal Top Surface.
Applications:
・Low Transmission Loss Substrate for High Frequency Band. (5G Communication)
・High Density Flip-Chip Stuffed Board
・MEMS/Sensor Substrate
・Sign Device Board including M-LED
Configuration of Substrate
（Cross Section-２）
・Synthetic Quartz：φ4 inch×0.22mmt
・Open Mouth Diameter of TGV：φ40μm
・TGV Pitch：150μm
・Metal is filled up voidlessly in TGV
Metallizing technology for glass materials (thin film to thick metal)
ITO / Cr / Ti / Al / Au / Ag / Cu / Ni / Mo alloys and more. Please contact us for details.
Electrode Pattern Manufacturing Technology
Electrode Patterning on both surface of the glass, and Multi Layer Electrode Pattern Manufacturing are also available. Please contact us for detail.
Via Hole Making by Sandbrast + Wet Etching Process
Configuration of Substrate
・Non-Alkali Glass
・φ12inch×0.3mmt
・Open Mouth Diameter：φ150μm
・Pitch：300μm
・Number of Holes：700,000 pieces.
・Metal Layer：8,000Å